压接
Interplex 是免焊接压接技术的全球先驱领导者，业已为众多业内龙头一流企业顶级客户生产压接组件十余载。作为全球性的创新力量，我们不断针对各行业的特定应用来相应地改进压接技术。
Interplex 压接技术的独特卖点
- 高强度的压接接头，消除了插针和插座互连组件相关的微动风险；
- 和与插针和与插座互连组件相比，降低了物料成本；
- 压接接头不会受到与焊接方式相关的质量问题的影响，比如冷点、空洞、飞溅和裂缝；
- 压接组件具有高度的可靠性和可重用性；
- 压接组件可以轻松定制，帮助封装设计人员满足其封装和可制造性目标；
- 无需使用贵金属；
- 降低或者消除了在印刷电路板上进行二次焊接的需要；
- 符合RoHS标准
深受信赖的全球性解决方案提供商
Interplex 的产品开发团队与全球各地的客户就近紧密合作，以开发满足特定终端应用需求的压接解决方案。例如：直插式端子、定制连接器和插头、压接式PCB连接器、定制成型的模块、电源引线框和其他电子封装解决方案。
我们利用自己在产品设计、应用工程、制造和自动化领域的专业经验，帮助客户针对其任何特定应用创建一站式解决方案。我们的足迹遍布全球，垂直整合了压接冲压、电镀、成型和装配工艺，可提供高度的设计灵活性、理想最佳的成本效益和生产能力扩展性。
我们的压接技术
面向汽车应用的免焊接压接端子
该技术可以实现将一个端子或者一根电气引线与一个 PCB 电镀通孔装配在一起，在不使用焊料的情况下创建并保持电气连接。
带压接端子的定制连接器
我们的压接技术应用在连接器和插头中，它们可以直接在 PCB 和交配性连接器之间实现定制互联。
压接模块外壳和传感器外壳
制造商在各种控制模块和传感器中使用我们的免焊接压接技术。通过将整个连接系统无缝集成到外壳封装中，我们的技术可以帮助客户设计低成本、高质量的产品，并消除二次焊接操作需求。
边卡表面贴装式压接连接器系统
Interplex 的表面贴装式边卡连接器系统使用一个分立表面贴装元件，为子卡应用创建了免焊接压接边卡连接器系统。它使用了 Interplex 经过测试和验证的 0.4 毫米或 0.64 毫米压接技术。汽车制造商在控制模块、开关、保险丝插座、接线盒、混动逆变器、各种传感器和连接器应用，以及其它发动机和乘客舱应用中广泛使用了压接技术。我们的无焊接压接技术经过了充分测试，可以满足汽车行业对振动和温度的严格要求
符合行业标准
Interplex不仅符合 IEC 60352-5 行业规范，而且其压接技术符合汽车行业内权威最大压接针脚客户的企业规范。
我们的压接技术的特征
- 压接区尺寸: 0.4mm, 0.64mm, 0.8mm, 1.2mm
- 端子尺寸: 行业标准尺寸（0.64毫米、1.5毫米、2.8毫米和6.3毫米）和定制尺寸
- 温度: 适用于 125°C 和 150°C 的工作温度，并提供可工作于 175°C 的选择
- 高导电性材料的导电率区间为 13-80%
- 兼容使用锡、银、金、有机可焊性防腐剂的电路板表面处理工艺
- 为低速或者高速插入而设计
- 有标准合金和高性能合金选项
- 灵活的模具设计，可进行低成本的变更
我们的产品组合
- 0.4毫米 MiniPLX™ 压接针脚
- Interplex Corporate Brochure
- Automotive Press-Fit Solderless Interconnects
- Plating Capabilities
- Press-Fit Technology
- Solderless Press-Fit Terminals for Automotive Applications
- New Hybrid Design 0.4mm Press-Fit Interconnects Enable Higher Density Applications
- Contact Resistance Analysis for Press-Fit Applications
- Determining PTH Integrity with Cross-Section Analysis
- Evaluation Checklist for Press-Fit Applications
- Mechanical Force Analysis for Press-Fit Applications
- PCB Hole Construction and Material Requirements for use with Press-Fit Technologies
- Press-Fit Current Carrying Capacity – Part 1 Application Requirements
- Press-Fit Current Carrying Capacity – Part 2 Current Testing & Results
- Press-Fit Current Carrying Capacity – Part 3 Design Considerations for Power Modules
- Supplier Best-Practices for Getting Results with Press-Fit Technology – Part 1 Design, Testing & Documentation
- Supplier Best-Practices for Getting Results with Press-Fit Technology – Part 2 Global Production Standards, Materials, Tooling and Process Controls
- Upgrading Product Designs From Solderjoints to Press-Fit – Why, When and How
- What is the “right size” for Press-Fit – New Micro, Mini and Macro Press-Fits Support Applications in the Wearable, Medical and Industrial Markets
- Adapting Press-Fit Connection Technology for Electronic Modules in Harsh Environments
- 0.64毫米压接针脚
- Interplex Corporate Brochure
- Automotive Press-Fit Solderless Interconnects
- Press-Fit Technology
- Solderless Press-Fit Terminals for Automotive Applications
- Contact Resistance Analysis for Press-Fit Applications
- Determining PTH Integrity with Cross-Section Analysis
- Evaluation Checklist for Press-Fit Applications
- Mechanical Force Analysis for Press-Fit Applications
- PCB Hole Construction and Material Requirements for use with Press-Fit Technologies
- Press-Fit Current Carrying Capacity – Part 1 Application Requirements
- Press-Fit Current Carrying Capacity – Part 2 Current Testing & Results
- Press-Fit Current Carrying Capacity – Part 3 Design Considerations for Power Modules
- Supplier Best-Practices for Getting Results with Press-Fit Technology – Part 1 Design, Testing & Documentation
- Supplier Best-Practices for Getting Results with Press-Fit Technology – Part 2 Global Production Standards, Materials, Tooling and Process Controls
- Upgrading Product Designs From Solderjoints to Press-Fit – Why, When and How
- Adapting Press-Fit Connection Technology for Electronic Modules in Harsh Environments
- 1.5毫米压接针脚
- Interplex Corporate Brochure
- Automotive Press-Fit Solderless Interconnects
- Press-Fit Technology
- Solderless Press-Fit Terminals for Automotive Applications
- Contact Resistance Analysis for Press-Fit Applications
- Determining PTH Integrity with Cross-Section Analysis
- Evaluation Checklist for Press-Fit Applications
- Mechanical Force Analysis for Press-Fit Applications
- PCB Hole Construction and Material Requirements for use with Press-Fit Technologies
- Press-Fit Current Carrying Capacity – Part 1 Application Requirements
- Press-Fit Current Carrying Capacity – Part 2 Current Testing & Results
- Press-Fit Current Carrying Capacity – Part 3 Design Considerations for Power Modules
- Supplier Best-Practices for Getting Results with Press-Fit Technology – Part 1 Design, Testing & Documentation
- Supplier Best-Practices for Getting Results with Press-Fit Technology – Part 2 Global Production Standards, Materials, Tooling and Process Controls
- Upgrading Product Designs From Solderjoints to Press-Fit – Why, When and How
- Adapting Press-Fit Connection Technology for Electronic Modules in Harsh Environments
- 2针压接插头
- Interplex Corporate Brochure
- Automotive Press-Fit Solderless Interconnects
- Plating Capabilities
- Press-Fit Technology
- Solderless Press-Fit Terminals for Automotive Applications
- Advanced Interconnect Designs to Optimize High-Mix Production Environments
- Contact Resistance Analysis for Press-Fit Applications
- Determining PTH Integrity with Cross-Section Analysis
- Evaluation Checklist for Press-Fit Applications
- Mechanical Force Analysis for Press-Fit Applications
- PCB Hole Construction and Material Requirements for use with Press-Fit Technologies
- Press-Fit Current Carrying Capacity – Part 1 Application Requirements
- Press-Fit Current Carrying Capacity – Part 2 Current Testing & Results
- Press-Fit Current Carrying Capacity – Part 3 Design Considerations for Power Modules
- Supplier Best-Practices for Getting Results with Press-Fit Technology – Part 1 Design, Testing & Documentation
- Supplier Best-Practices for Getting Results with Press-Fit Technology – Part 2 Global Production Standards, Materials, Tooling and Process Controls
- Upgrading Product Designs From Solderjoints to Press-Fit – Why, When and How
- Adapting Press-Fit Connection Technology for Electronic Modules in Harsh Environments
- 4针压接插头
- Interplex Corporate Brochure
- Automotive Press-Fit Solderless Interconnects
- Plating Capabilities
- Press-Fit Technology
- Solderless Press-Fit Terminals for Automotive Applications
- Advanced Interconnect Designs to Optimize High-Mix Production Environments
- Contact Resistance Analysis for Press-Fit Applications
- Determining PTH Integrity with Cross-Section Analysis
- Evaluation Checklist for Press-Fit Applications
- Mechanical Force Analysis for Press-Fit Applications
- PCB Hole Construction and Material Requirements for use with Press-Fit Technologies
- Press-Fit Current Carrying Capacity – Part 1 Application Requirements
- Press-Fit Current Carrying Capacity – Part 2 Current Testing & Results
- Press-Fit Current Carrying Capacity – Part 3 Design Considerations for Power Modules
- Supplier Best-Practices for Getting Results with Press-Fit Technology – Part 1 Design, Testing & Documentation
- Supplier Best-Practices for Getting Results with Press-Fit Technology – Part 2 Global Production Standards, Materials, Tooling and Process Controls
- Upgrading Product Designs From Solderjoints to Press-Fit – Why, When and How
- Adapting Press-Fit Connection Technology for Electronic Modules in Harsh Environments
- 压接插头
- Interplex a Brochure
- Automotive Press-Fit Solderless Interconnects
- Press-Fit Technology
- Solderless Press-Fit Terminals for Automotive Applications
- Advanced Interconnect Designs to Optimize High-Mix Production Environments
- Contact Resistance Analysis for Press-Fit Applications
- Determining PTH Integrity with Cross-Section Analysis
- Evaluation Checklist for Press-Fit Applications
- Mechanical Force Analysis for Press-Fit Applications
- PCB Hole Construction and Material Requirements for use with Press-Fit Technologies
- Press-Fit Current Carrying Capacity – Part 1 Application Requirements
- Press-Fit Current Carrying Capacity – Part 2 Current Testing & Results
- Press-Fit Current Carrying Capacity – Part 3 Design Considerations for Power Modules
- Supplier Best-Practices for Getting Results with Press-Fit Technology – Part 1 Design, Testing & Documentation
- https://interplex.com.cn/wp-content/uploads/2018/11/Press-Fit-Design-Testing-1.pdf
- Upgrading Product Designs From Solderjoints to Press-Fit – Why, When and How
- Adapting Press-Fit Connection Technology for Electronic Modules in Harsh Environments
- 压接针脚
- Interplex Corporate Brochure
- Automotive Press-Fit Solderless Interconnects
- Plating Capabilities
- Press-Fit Technology
- Solderless Press-Fit Terminals for Automotive Applications
- Contact Resistance Analysis for Press-Fit Applications
- Determining PTH Integrity with Cross-Section Analysis
- Evaluation Checklist for Press-Fit Applications
- Mechanical Force Analysis for Press-Fit Applications
- PCB Hole Construction and Material Requirements for use with Press-Fit Technologies
- Press-Fit Current Carrying Capacity – Part 1 Application Requirements
- Press-Fit Current Carrying Capacity – Part 2 Current Testing & Results
- Press-Fit Current Carrying Capacity – Part 3 Design Considerations for Power Modules
- Supplier Best-Practices for Getting Results with Press-Fit Technology – Part 1 Design, Testing & Documentation
- Supplier Best-Practices for Getting Results with Press-Fit Technology – Part 2 Global Production Standards, Materials, Tooling and Process Controls
- Upgrading Product Designs From Solderjoints to Press-Fit – Why, When and How
- Adapting Press-Fit Connection Technology for Electronic Modules in Harsh Environments
- 压接针脚
- Interplex Corporate Brochure
- Automotive Press-Fit Solderless Interconnects
- Plating Capabilities
- Press-Fit Technology
- Solderless Press-Fit Terminals for Automotive Applications
- Contact Resistance Analysis for Press-Fit Applications
- Determining PTH Integrity with Cross-Section Analysis
- Evaluation Checklist for Press-Fit Applications
- Mechanical Force Analysis for Press-Fit Applications
- PCB Hole Construction and Material Requirements for use with Press-Fit Technologies
- Press-Fit Current Carrying Capacity – Part 1 Application Requirements
- Press-Fit Current Carrying Capacity – Part 2 Current Testing & Results
- Press-Fit Current Carrying Capacity – Part 3 Design Considerations for Power Modules
- Supplier Best-Practices for Getting Results with Press-Fit Technology – Part 1 Design, Testing & Documentation
- Supplier Best-Practices for Getting Results with Press-Fit Technology – Part 2 Global Production Standards, Materials, Tooling and Process Controls
- Upgrading Product Designs From Solderjoints to Press-Fit – Why, When and How
- Adapting Press-Fit Connection Technology for Electronic Modules in Harsh Environments
- 双端头压接针脚
- Interplex Corporate Brochure
- Automotive Press-Fit Solderless Interconnects
- Press-Fit Technology
- Solderless Press-Fit Terminals for Automotive Applications
- Contact Resistance Analysis for Press-Fit Applications
- Determining PTH Integrity with Cross-Section Analysis
- Evaluation Checklist for Press-Fit Applications
- Mechanical Force Analysis for Press-Fit Applications
- PCB Hole Construction and Material Requirements for use with Press-Fit Technologies
- Press-Fit Current Carrying Capacity – Part 1 Application Requirements
- Press-Fit Current Carrying Capacity – Part 2 Current Testing & Results
- Press-Fit Current Carrying Capacity – Part 3 Design Considerations for Power Modules
- Supplier Best-Practices for Getting Results with Press-Fit Technology – Part 1 Design, Testing & Documentation
- Supplier Best-Practices for Getting Results with Press-Fit Technology – Part 2 Global Production Standards, Materials, Tooling and Process Controls
- Upgrading Product Designs From Solderjoints to Press-Fit – Why, When and How
- What is the “right size” for Press-Fit – New Micro, Mini and Macro Press-Fits Support Applications in the Wearable, Medical and Industrial Markets
- Adapting Press-Fit Connection Technology for Electronic Modules in Harsh Environments
- 燃油液位传感器连接器
- Interplex Corporate Brochure
- Automotive Press-Fit Solderless Interconnects
- Press-Fit Technology
- Solderless Press-Fit Terminals for Automotive Applications
- Contact Resistance Analysis for Press-Fit Applications
- Determining PTH Integrity with Cross-Section Analysis
- Evaluation Checklist for Press-Fit Applications
- Mechanical Force Analysis for Press-Fit Applications
- PCB Hole Construction and Material Requirements for use with Press-Fit Technologies
- Press-Fit Current Carrying Capacity – Part 1 Application Requirements
- Press-Fit Current Carrying Capacity – Part 2 Current Testing & Results
- Press-Fit Current Carrying Capacity – Part 3 Design Considerations for Power Modules
- Supplier Best-Practices for Getting Results with Press-Fit Technology – Part 1 Design, Testing & Documentation
- Supplier Best-Practices for Getting Results with Press-Fit Technology – Part 2 Global Production Standards, Materials, Tooling and Process Controls
- Upgrading Product Designs From Solderjoints to Press-Fit – Why, When and How
- Adapting Press-Fit Connection Technology for Electronic Modules in Harsh Environments
- 直插式压接针脚
- Interplex Corporate Brochure
- Automotive Press-Fit Solderless Interconnects
- Press-Fit Technology
- Solderless Press-Fit Terminals for Automotive Applications
- Contact Resistance Analysis for Press-Fit Applications
- Determining PTH Integrity with Cross-Section Analysis
- Evaluation Checklist for Press-Fit Applications
- Mechanical Force Analysis for Press-Fit Applications
- PCB Hole Construction and Material Requirements for use with Press-Fit Technologies
- Press-Fit Current Carrying Capacity – Part 1 Application Requirements
- Press-Fit Current Carrying Capacity – Part 2 Current Testing & Results
- Press-Fit Current Carrying Capacity – Part 3 Design Considerations for Power Modules
- Supplier Best-Practices for Getting Results with Press-Fit Technology – Part 1 Design, Testing & Documentation
- Supplier Best-Practices for Getting Results with Press-Fit Technology – Part 2 Global Production Standards, Materials, Tooling and Process Controls
- Upgrading Product Designs From Solderjoints to Press-Fit – Why, When and How
- Adapting Press-Fit Connection Technology for Electronic Modules in Harsh Environments
- 表面贴装压接针脚
- Interplex Corporate Brochure
- Automotive Press-Fit Solderless Interconnects
- Plating Capabilities
- Press-Fit Technology
- Solderless Press-Fit Terminals for Automotive Applications
- Contact Resistance Analysis for Press-Fit Applications
- Determining PTH Integrity with Cross-Section Analysis
- Evaluation Checklist for Press-Fit Applications
- Mechanical Force Analysis for Press-Fit Applications
- Next Generation High Density SMT Solderless Edge Card Connector System
- PCB Hole Construction and Material Requirements for use with Press-Fit Technologies
- Press-Fit Current Carrying Capacity – Part 1 Application Requirements
- Press-Fit Current Carrying Capacity – Part 2 Current Testing & Results
- Press-Fit Current Carrying Capacity – Part 3 Design Considerations for Power Modules
- SMT Card-Edge Solutions Using Solderfree Press-Fit Technology – Part 1 Application Requirements
- SMT Card-Edge Solutions Using Solderfree Press-Fit Technology – Part 2 Specifications & Design Considerations
- Supplier Best-Practices for Getting Results with Press-Fit Technology – Part 1 Design, Testing & Documentation
- Supplier Best-Practices for Getting Results with Press-Fit Technology – Part 2 Global Production Standards, Materials, Tooling and Process Controls
- Upgrading Product Designs From Solderjoints to Press-Fit – Why, When and How
- Adapting Press-Fit Connection Technology for Electronic Modules in Harsh Environments
0.4毫米 MiniPLX™ 压接针脚
Establishes solderless electro-mechanical board-to-board connection in EPS ECU.
资源
0.64毫米压接针脚
Establishes solderless electro-mechanical connection to PCB within sensor connector integrated in pedal unit, which transmits information related to pedal position for various functions in hybrid cars such as braking and start-stop functions, to name a few.
资源
1.5毫米压接针脚
Establishes solderless electro-mechanical connection to PCB within sensor connector integrated in pedal unit, which transmits information related to pedal position for various functions in hybrid cars such as braking and start-stop functions, to name a few.
资源
2针压接插头
Establishes solderless electro-mechanical connection in crash sensor, which detects impact of crash and activates airbag inflation.
资源
4针压接插头
Establishes solderless electro-mechanical connection in crash sensor, which detects impact of crash and activates airbag inflation.
资源
压接插头
Establishes solderless electro-mechanical connection to PCB for climate control system in center stack display.
资源
压接针脚
Establishes solderless electro-mechanical connection to PCB for intake manifold temperature and pressure sensor.
资源
压接针脚
Establishes solderless electro-mechanical connection to PCB of Body Control Module for control of power steering functions.
资源
双端头压接针脚
Establishes solderless electro-mechanical connection between PCBs for rear view mirror.
资源
燃油液位传感器连接器
Sensor connector for fuel level sensor, which measures how much fuel there is in fuel tank.
资源
直插式压接针脚
Establishes solderless electro-mechanical connection to PCB for window switches.
资源
表面贴装压接针脚
Establishes robust 90° solderless electro-mechanical connection between PCBs in smart mirrors.
资源
图库
PCB通孔上的压接针脚
PCB通孔上的压接针脚横断面
0.8 鱼眼孔式板对板双端头压接端子
0.64x0.64 鱼眼孔式压接端子
单眼压接端子
双眼压接端子
三眼压接端子
定制成型模块中的压接
双端头0.64鱼眼孔式压接端子
双端头0.8鱼眼孔式压接端子
免焊接电路堆叠应用
基于压接互连的定制组件
压接端子
压接针的鱼眼孔
免焊接压接针脚和端子